More details about our fabrication and characterization tools, coming soon!


It is a class 10000 clean room, with a surface of 50 m2. The clean room is available and being used for the preparation of thin molecular films in a dust free environment, necessary for a flawless electronic characterization.
The clean room is shielded from UV radiation coming from illumination. This protects sensitive materials during the whole fabrication-measurement process.

Vertical laminar air flow cabinet Model V70 from Telstar

Vertical Laminar Flow Bench with containment to deliver an ultraclean laminar airflow over a working bench to protect manipulated products from dust, from environment contamination and from cross contamination in the working area. All over pressure zones are surrounded by under negative pressure to prevent any leak back into the room or the clean zones of the cabinet. An additional air flow enters from the front to create an air barrier which brings protection to operator and to lab environment. The unit is provided with two HEPA-14 filters, one for the downflow and another for the exhaust. 70% of the air is recirculated thus minimizing filter clogging and the other 30% is expelled through HEPA-14 filter at top of the unit.

Laminar flow cabinet BC-Technology Type BC-CAU-07-12

Vertical Laminar Flow cabin equipped with active carbon filter to deliver an ultraclean laminar airflow over a working bench to protect manipulated products from dust from environment contamination and from cross contamination in the working area. The active carbon filter allows the operator to work with organic solvents and the additional air flow enters from the front to create an air barrier for vapor solvent flow to the room. The unit is provided with HEPA H14 filter.

Laminar flow cabinet

Vertical laminar flow cabin equipped with a spin coater SUSS DELTA 80 with GYRSET.
This spin coater is a semi-automatic system designed to coat wafers and substrates in a size range up to 150×150 mm2.
The GYRSET technology allow a slow rate of solvent evaporation during coating yielding to smooth-surface thin films, thanks to an automatic lid that covers the substrate and creates a solvent-saturated atmosphere. Multiple-steps recipes can be programmed for full control of coating conditions (speed, acceleration and time). The unit works in the speed range of 100-5000 rpm.

Spin coater, model KW-4a, Chemat technology

Chemat Technologies model KW-4A is a compact spin coater for precise and uniform deposition of thin films and coatings (metal oxide thin films, polymer coatings and metal organic thin films).
It has a two-stage spin process; this allows dispensing at low speeds and homogenizing the coating at high speed.
Stage 1: 500-2500 rpm (2-18 Seconds)
Stage 2: 800-8000 rpm (3-60 Seconds)
Several sample chucks are available to hold substrates from sizes ranging from 5×5 to 30×30 mm2.

Molecular thermal evaporators

High vacuum chambers integrated in a nitrogen glove box equipped with a water-cooled turbo molecular pump (pressure below 10-6 mbar). The deposition system consists in 6 individual thermal sources with alumina crucible and integrated shutter. Typical deposition rates varies between 0.01 and 50 Å/s, with a temperature range 50 °C – 800 °C and stability < 0.1 °C. The system is water cooled, with 3 temperature controlled power supplies, which allow co-evaporation of different materials. 3 water-cooled quartz crystal microbalance (QCM) sensors are used to measure the rate of material evaporation with a 1 Å resolution.

Metals thermal evaporators

A vacuum chamber placed inside the glove box can achieve high vacuum, at pressures bellow 10-6 mbar. It is used for the thermal evaporation of metals (Al, Ba, Ca, Ag, Au) and other compounds (LiF, Cs2CO3) onto the surface of solids substrates.
Mainly used for the preparation of the anode/cathode on OLEDs and solar cells. It is a very precise tool for the evaporation of materials with high sublimation temperature.
Thickness is monitored with an Edwards FTM7 film thickness monitor.

Surface treatment and cleaning of the surfaces by plasma technology system Flecto 10

Plasma systems for cleaning or surface modification of small components and substrates. The system is can use different gasses (O2, N2, H2, Ar) for a variety of applications. As well as plasma cleaning and degreasing, etching and coating are all easily carried out with this system. The maximum power is 300 W, and the inner chamber dimensions are 190 x 190 x 320 mm. The plasma system is computer-controlled for virtualization of the process data. Process diagrams can be stored locally or via network

UVO-Cleaner Jelight 42-220

UVO-cleaner for surface cleaning of substrates used in opto-electronic devices. A mercury vapor grid lamp emits at 184.9 nm and 253.7 nm UV for generation of atomic oxygen and ozone. It has a capacity of approximately 15×15 cm tray size and it is coupled with an exhaust for ozone removal for operator safety.

Solar simulation MiniSun (ECN, the Netherlands)

A solar simulator for characterizing solar cells in lab scale in inert atmosphere. The system is able for measuring the external quantum efficiency (EQE) and current density-voltage (J-V) characteristics of solar cells. The EQE is estimated using the cell response at different wavelength (from 350 nm to 1150 nm) measured with the white light halogen lamp in combination with band-pass filters. The J-V characteristics are obtained using a Keithley 2400 source measure unit.

Solar simulation (Abet Technologies)

A solar simulator for characterizing solar cells in lab scale in air. The model is 10500, a compact and integrated system with an AM1.5G xenon arc lamp as the light source. Before each measurement, the exact light intensity was determined using a calibrated Si reference diode equipped with an infrared cut-off filter (KG-3, Schott). The J-V characteristics are obtained using a Keithley 2612A source measure unit.

Profilometer Ambios XP1

An Ambios-Technology profilometer model XP-1, placed on a vibration isolation table.
Sample Stage Diameter:140mm
Scan Length Range: 30mm maximum
Sample Thickness: 20mm maximum
Vertical Resolution: 1Å at 10µm, 15Å at 100µm, 62Å at 400µm
Vertical Range: 400µm maximum
Magnification: 100X fixed objective with and attached CCD camera.
Stylus Tip Radius 2.0 microns
Stylus Force Range .05-10mg (programmable)
Scan Filtering Low-pass, high-pass, band-pass, and adjustable filter
The software performs calculation of surface roughness (Ra, Rq, Rp, Rv, Rt, Rz).